The VIEW Summit systems are designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in the VIEW Pinnacle, the Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.
The Summit systems are ideal for measurement of large format parts requiring high accuracy, such as solder paste stencils and screens, artwork, panelized printed circuit boards, flex circuits, and micro-etched parts.
Summit models can be equipped with an optional through-the-lens or offset mounted laser for added flexibility in Z-axis measurements. Summit models can also utilize the optional SpectraProbe™ offering sub-micron Z-axis measurement resolution.
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