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NX9000​

Real-time 3D analytical FIB-SEM​

FIB-SEM System for True 3D Structural Analysis

The newly developed FIB-SEM system from Hitachi, the NX9000 incorporates an optimized layout for true high-resolution serial sectioning to tackle the latest demands in 3D structural analysis and for TEM and 3DAP analyses. The NX9000 FIB-SEM system allows the highest precision in material processing for a wide range of areas relating to advanced materials, electronic devices, biological tissues, and a multitude of other applications.​

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  • Features
  • Resources

◙ The SEM column and FIB column are orthogonally arranged to optimize the column positioning for 3D structural analysis.

◙ The combination of high-brightness cold-field-emission electron source and high-sensitivity optics support analysis of a wide range of materials from biological tissues to magnetic materials.

◙ The Micro-sampling system and Triple Beam system allow high-quality sample preparation for TEM and atom-probe applications.

◙ Ion milling and observation at normal incidence in real-time for true analytical imaging

◙ Cut & See · 3D-EDS · 3D-EBSD available for a wide variety of materials (option)

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