Powerful scan technology

• High speed technology: 1000 mm/sec scan speed, 500 MHz receiver bandwidth, 3 GHz data sampling rate
• Dual channel data acquisition for minimizing the acquisition time on one sample, or for simultaneous data acquisition on 2 different samples
• Simultaneous pulse-echo and through transmission acquisition supported
• Up to 6 axis control, including 2-fold transducer tilt for wedge and contour scans

Advanced software features

• Real time full waveform acquisition: Collected data allow offline rescanning of the sample with different gate settings
• Advanced analysis features: Generation of virtual B-scans and tomographic C-scans from stored data files
• Slice scan for acquisition of a virtually unlimited number of C-scans on different depth levels simultaneously
• Multi-lingual software in English, Japanese, Chinese, French, German, …

 Wide application range

      Semiconductor and microelectronics

• CSP and Flip Chip underfil void evaluation and delamination analysis
• Power semiconductor integrity evaluation
• Internal defect inspection: Inclusions, cracks, die tilt
• Interface evaluation of bonded wafers

      Material analysis

• Inclusion, crack and void detection in metals, plastics, resin

      Interface analysis

• Void evaluation in welds and brazed interfaces
• Electrostatic chuck void detection
• Delamination of composite materials
• Interface analysis on heterogeneous assembled materials