ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polish­ing of  die, package , module and wafer-level devices.

Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic sample preparation, IPS is ‘device-centric’ – designed to meet the non-destructive, high yield and survivability needs of electronic components.

IPS’ Touch Screen OS has been designed from the ground-up to control all aspects of the sample preparation process. Advanced programming drives IPS’s deep sub-micron axes of motion. The machine vision monitor provides a unique ‘always-live’ image of the device, along with key navigational and process information.